JPH038424U - - Google Patents

Info

Publication number
JPH038424U
JPH038424U JP1989067814U JP6781489U JPH038424U JP H038424 U JPH038424 U JP H038424U JP 1989067814 U JP1989067814 U JP 1989067814U JP 6781489 U JP6781489 U JP 6781489U JP H038424 U JPH038424 U JP H038424U
Authority
JP
Japan
Prior art keywords
heat treatment
heat
section
treatment section
buffer storage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1989067814U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0536269Y2 (en]
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989067814U priority Critical patent/JPH0536269Y2/ja
Priority to KR1019900008438A priority patent/KR930010971B1/ko
Publication of JPH038424U publication Critical patent/JPH038424U/ja
Application granted granted Critical
Publication of JPH0536269Y2 publication Critical patent/JPH0536269Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
JP1989067814U 1989-06-09 1989-06-09 Expired - Lifetime JPH0536269Y2 (en])

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP1989067814U JPH0536269Y2 (en]) 1989-06-09 1989-06-09
KR1019900008438A KR930010971B1 (ko) 1989-06-09 1990-06-08 기판을 열처리하기 위한 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989067814U JPH0536269Y2 (en]) 1989-06-09 1989-06-09

Publications (2)

Publication Number Publication Date
JPH038424U true JPH038424U (en]) 1991-01-28
JPH0536269Y2 JPH0536269Y2 (en]) 1993-09-14

Family

ID=13355791

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989067814U Expired - Lifetime JPH0536269Y2 (en]) 1989-06-09 1989-06-09

Country Status (2)

Country Link
JP (1) JPH0536269Y2 (en])
KR (1) KR930010971B1 (en])

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59211243A (ja) * 1983-05-17 1984-11-30 Toshiba Corp 半導体基板処理装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59211243A (ja) * 1983-05-17 1984-11-30 Toshiba Corp 半導体基板処理装置

Also Published As

Publication number Publication date
KR930010971B1 (ko) 1993-11-18
KR910001897A (ko) 1991-01-31
JPH0536269Y2 (en]) 1993-09-14

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